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YNV12T10 DC-DC Converter Data Sheet
9.6-14 VDC Input; 0.7525-5.5 VDC Programmable @ 10A
The
Products: Y-Series
Features
? RoHS lead-free solder and lead-solder-exempted
products are available
? Delivers up to 10 A (50 W)
? Industry-standard footprint and pinout
? Single-In-Line (SIP) Package: 2.0” x 0.535” x 0.28”
(50.8 x 13.59 x 7.11 mm)
? Weight: 0.25 oz [7 g]
Applications
? Intermediate Bus Architectures
? Telecommunications
? Data communications
? Servers, workstations
? Distributed Power Architectures
Benefits
? High efficiency – no heat sink required
? Reduces total solution board area
? Minimizes part numbers in inventory
? Synchronous Buck Converter topology
? Start-up into pre-biased output
? No minimum load required
? Operating ambient temperature: -40 °C to 85 °C
? Remote output sense
? Remote ON/OFF (Positive or Negative)
? Fixed-frequency operation
? Auto-reset output overcurrent protection
? Auto-reset overtemperature protection
? High reliability, MTBF = 35.5 million hours
? All materials meet UL94, V-0 flammability rating
? UL60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN60950
Description
Power-One’s point-of-load converters are recommended for use with regulated bus converters in an
Intermediate Bus Architecture (IBA). The YNV12T10 non-isolated DC-DC converters deliver up to 10 A of
output current in an industry-standard through hole (SIP) package. The YNV12T10 converters operate from a
9.6–14 VDC input. These converters are ideal choices for Intermediate Bus Architectures where Point-of-
Load power delivery is generally a requirement. They provide a resistor-programmable regulated output
voltage of 0.7525 V to 5.5 V.
The YNV12T10 converters provide exceptional thermal performance, even in high temperature environments
with minimal airflow. This is accomplished through the use of circuit, packaging and processing techniques to
achieve ultra-high efficiency, excellent thermal management and a very sleek body profile.
The sleek body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
MCD10202 Rev. 1.0, 24-Jun-10
Page 1 of 25
www.power-one.com
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